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August 14, 2023
Telink Semiconductor is thrilled to announce its forthcoming attendance at Nepcon Vietnam 2023, where we are set to engage with the forefront of global IoT innovators. The event is scheduled to take place from September 6th to 8th at the esteemed Hanoi International Exhibition Center, Vietnam. We are dedicated to the pioneering concept of “Inside Electronics 4.0,” as we present our cutting-edge IoT chip technology.
Renowned as a premier provider of IoT chips, Telink Semiconductor is unwavering in our commitment to offering the most advanced chip solutions to a global clientele. Our showcase at Nepcon Vietnam 2023 will highlight our stellar TLSR8 and TLSR9 series SoCs, exemplifying our industry-leading product range. These low-power, highly-integrated SoCs boast a myriad of rich interfaces, making them a cornerstone in various IoT applications, including Smart Homes, Remote Control, Wireless Audio, Human Interface Devices, Wearables, Electronic Shelf Labels, Location Services, Wireless Gaming, Health and Wellness, and Bluetooth Dual-mode multi-connection.
To facilitate an immersive understanding of cutting-edge IoT technology, we have thoughtfully curated a series of application demonstrations. Of particular note are our 3-in-1 Low-latency Wireless Gaming Demo and Bluetooth & UWB Module Demo, both of which will showcase Telink’s prowess in the development and application of the latest wireless technologies.
Nepcon Vietnam 2023 presents an exceptional opportunity for Telink to foster profound dialogues and collaborations with esteemed customers and visitors from around the globe. We eagerly anticipate the chance to connect with you on this dynamic platform, delving into the trends and potential applications of IoT chip technology. (Visit Telink at Booth No. X14)
For any inquiries or to explore collaboration prospects, please do not hesitate to reach out to us:
Email: [email protected]
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Founded in 2010, Telink Semiconductor (Shanghai) Co., Ltd. is a semiconductor-design company dedicated to the development of high-performance and low-power wireless IoT system-level chips and protocol stacks. The company is headquartered in Shanghai, with multiple subsidiaries and offices in North America, Europe, and the Asia-Pacific region. Telink’s main business is the design and sales of integrated circuit chips while also providing related technical consultation and services. Its main research, development, and sales of its chips include Bluetooth® Classic, Bluetooth® Low Energy, Bluetooth® Mesh, Zigbee, 6LoWPAN/Thread, Matter, Apple HomeKit, Apple Find My, and 2.4GHz private protocols.