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The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.
The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth® LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.
Telink has been one of the IC partners recommended by a US T1 ecosystem player for its smart home platform since 2016.
Telink’s SDKs are built to support seamless interoperability with most mainstream ecosystems right out of the box.
Telink’s multi-protocol SoCs and SDKs support mainstream standards on the same silicon, reducing manufacturers’ risk of being locked in one technology.