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The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.
The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth® LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.
Telink has been one of the IC partners recommended by a US T1 ecosystem player for its smart home platform since 2016.
Telink’s SDKs are built to support seamless interoperability with most mainstream ecosystems right out of the box.
Telink’s multi-protocol SoCs and SDKs support mainstream standards on the same silicon, reducing manufacturers’ risk of being locked in one technology.
Smart devices that are easy to use and deliver seamless connectivity and convenience are in high demand. From smart lighting systems to smart locks and everything in between, Telink’s chips deliver the high
performance, power efficiency, optimized BOM cost, and outof-the-box interoperability developers need to build the home of the future.