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The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.
The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.
Telink offers dualmode Bluetooth capabilities on a single chip, simplifying hardware design, lowering system cost, and allowing for more innovative products.
Developed based on proven technology, Telink’s multi-connection SDK supports simultaneous Bluetooth Classic and multiple Bluetooth LE connections.
Telink’s highperformance SoCs and mature SDK enable stable connections to multiple Bluetooth peripherals simultaneously, even in the most complex multitasking use cases.