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The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.
The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.
Telink’s multiprotocol chips support major connectivity standards, reducing the risk involved in protocol selection for manufacturers and offering greater flexibility.
Telink’s SoCs have passed comprehensive compatibility tests for most mainstream mobile phones, and are built to operate seamlessly in today’s complex smart home ecosystems.
Telink’s solutions deliver industry-leading connection stability, power consumption, and BOM savings for smart home devices.
Telink was one of the first companies to deliver solutions for Bluetooth LE Mesh, which is now the fastest-growing smart home/smart lighting standard and has been adopted in most Tier 1 ecosystems.
Integrate devices with Tier 1 customers’ platforms on Telink’s reliable, mature, and cost-efficient 802.15.4 SoCs and protocol stack.
Certified by Thread, Telink can help customers quickly develop IoT smart devices that comply with both the
Thread protocol and Matter standards.