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The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.
The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.
Telink’s multiprotocol chips support major connectivity standards, reducing the risk involved in protocol selection for manufacturers and offering greater flexibility.
Telink’s SoCs have passed comprehensive compatibility tests for most mainstream mobile phones, and are built to operate seamlessly in today’s complex smart home ecosystems.
Telink’s solutions deliver industry-leading connection stability, power consumption, and BOM savings for smart home devices.