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The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.
The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth® LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.
With its Zigbee development dating back to the early days of the company’s history, Telink is now among the world’s top Zigbee SoC suppliers.
Telink’s multi-protocol SoCs and concurrent SDK enables direct smart phone access to the Zigbee network via Bluetooth LE, which is critical to a better user experience.
Telink’s multi-protocol SoCs support both Zigbee and Bluetooth Mesh on the same silicon along with choice of flexible switching schemes from one to the other.