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Bluetooth means big install bases, large addressable markets, and major economies of scale — but none of that matters unless you partner with a semiconductor company that speaks the same language.
Efficient from every angle: Telink chips are power-efficient, cost-efficient, and tightly packaged.
With a robust developer ecosystem and powerful tools (Telink Tool Chain, Eclipse IDE), our tried-and-tested Bluetooth LE stack supports any developer taking their product to market.
Getting Bluetooth LE devices to talk to each other is easier said than done. Well, we’ve done it. We were one of the first to ship a Bluetooth mesh lighting solution, and we’ll be one of the first to ship the Bluetooth LE mesh applications of the future.
5.0, 2Mbps PHY-only Basic Bluetooth LE chip supporting Bluetooth LE 5.0, with a 2Mbps PHY, 512KB Flash, and multiple IOs for a variety of applications.
Advanced SoC supporting multiple concurrent protocols. Supports all Bluetooth LE 5.1 features including AoA/AoD and Bluetooth LE Mesh. Offers high performance RF and low power consumption.
Bluetooth LE chip supporting Bluetooth LE 5.1, including AoA/AoD, Bluetooth LE Mesh, and ADV extensions.