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The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.
The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.
Bluetooth LE brings with it a massive installed user base, diverse addressable markets, and major economies of scale.
Telink’s Bluetooth LE chips are power-efficient, cost-effective, and compact.
Telink’s tried-and-tested Bluetooth LE stack can support developers taking nearly any product to market.
Telink’s Bluetooth LE chips and SDKs are compliant with the latest version of Bluetooth standards and features.