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Bluetooth® LE


Efficient. Mature. Proven in millions of devices.

We ship millions of Bluetooth® LE chips every year into every vertical imaginable. We’ve developed a mature, efficient Bluetooth LE stack that’s designed to deliver exactly what our customers need: performance, reliability, and scale. We know Bluetooth better than we know ourselves.

Benefits of Bluetooth® LE


Bluetooth technology means big install bases, large addressable markets, and major economies of scale, but you need a partner like Telink to take advantage.


Efficient from every angle: Telink chips are power-efficient, cost-efficient, and tightly packaged.

Powerful Tools

With a robust developer ecosystem and powerful tools (Telink Tool Chain, Eclipse IDE), our tried-and-tested Bluetooth LE stack supports any developer taking their product to market.

Applications for Bluetooth® LE

Getting Bluetooth LE devices to talk to each other is easier said than done. Well, we’ve done it. We were one of the first to ship a Bluetooth Mesh lighting solution, and we’ll be one of the first to ship the Bluetooth Mesh applications of the future.

Telink Chips for Bluetooth® LE


The TLSR825x series delivers an ultra-low power (ULP) concurrent multiprotocol IoT solution on the ISM 2.4GHz band. It has full protocol support for Bluetooth LE 5.0. It also supports Bluetooth Mesh, Zigbee, RF4CE, HomeKit, Thread, ANT, and 2.4GHz proprietary.


The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.


The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.

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