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    • Bluetooth® LE

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    Efficient. Mature. Proven in millions of devices.

    Introduced in Bluetooth version 4.0, Bluetooth LE is a significant foundation for IoT applications. Unlike Bluetooth Classic, Bluetooth LE is more prominent in applications where power consumption is crucial and where small amounts of data are transferred infrequently. Telink's market-proven Bluetooth LE SoCs and SDKs have been powering hundreds of millions of IoT devices since 2014.

    Telink Chips for Bluetooth® LE

    TLSR921x

    The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.

     

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    TLSR827x

    The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.

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    TLSR825x

    The TLSR825x series delivers an ultra-low power (ULP) concurrent multiprotocol IoT solution on the ISM 2.4GHz band. It has full protocol support for Bluetooth LE 5.0. It also supports Bluetooth Mesh, Zigbee, RF4CE, HomeKit, Thread, and 2.4GHz proprietary.

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    Telink Advantage

    Scale

    Bluetooth LE brings with it a massive installed user base, diverse addressable markets, and major economies of scale.

    Efficiency

    Telink’s Bluetooth LE chips are power-efficient, cost-effective, and compact.

    Full Stack

    Telink’s tried-and-tested Bluetooth LE stack can support developers taking nearly any product to market.

    Standard

    Telink’s Bluetooth LE chips and SDKs are compliant with the latest version of Bluetooth standards and features.

    Applications for Bluetooth® LE

    Remote Controls

    Remote controlRemote controlGet the flexibility to build feature-packed, user-friendly remote controls, scale rapidly, and adjust to new entertainment technology on the fly.

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    Health and Wellness

    RFIDs based on embedded Bluetooth LE chips have become the first choice for adding intelligence to healthcare devices and consumer goods.

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    Location Services

    IoT devices can use approaches like RSSI, AoA, AoD, or even more sophisticated algorithms to deliver highly precise location services.

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    Smart Home

    Smart homesSmart devices that are easy to use and deliver seamless connectivity and convenience are in high demand. From smart lighting systems to smart locks and everything in between, Telink’s chips deliver the high performance, power efficiency, optimized BOM cost, and outof-the-box interoperability developers need to build the home of the future.

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    Human Interface Devices

    Seamless connectivity is essential in the wireless human interface device market — devices that drop a connection will get dropped themselves.

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    Wearables

    Wearable devices have grown into a major market over the past decade. Most recently, a number of wearable contact tracing and social distancing solutions have hit the market in an effort to stop the spread of the novel coronavirus.

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    Bluetooth Multi-Connection

    From data transfer to audio streaming, multiple peripheral devices can connect over both types of Bluetooth radios simultaneously to the central device powered by a Telink dual-mode SoC and multiconnection SDK.

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    Wireless Audio

    Moving from traditional single-purpose devices like wireless stereo headsets and speakers to True Wireless Stereo (TWS) earbuds and next generation Bluetooth LE Audio devices, new audio streaming products are ready for prime time.

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