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Bluetooth LE

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Efficient. Mature. Proven in millions of devices.

We ship millions of Bluetooth LE chips every year into every vertical imaginable. We’ve developed a mature, efficient Bluetooth LE stack that’s designed to deliver exactly what our customers need: performance, reliability, and scale. We know Bluetooth better than we know ourselves.

Benefits of Bluetooth LE

Scale

Bluetooth means big install bases, large addressable markets, and major economies of scale — but none of that matters unless you partner with a semiconductor company that speaks the same language.

Efficiency

Efficient from every angle: Telink chips are power-efficient, cost-efficient, and tightly packaged.

Powerful Tools

With a robust developer ecosystem and powerful tools (Telink Tool Chain, Eclipse IDE), our tried-and-tested Bluetooth LE stack supports any developer taking their product to market.

Applications for Bluetooth LE

Getting Bluetooth LE devices to talk to each other is easier said than done. Well, we’ve done it. We were one of the first to ship a Bluetooth mesh lighting solution, and we’ll be one of the first to ship the Bluetooth LE mesh applications of the future.

Telink Chips for Bluetooth LE

TLSR8232

5.0, 2Mbps PHY-only Basic Bluetooth LE chip supporting Bluetooth LE 5.0, with a 2Mbps PHY, 512KB Flash, and multiple IOs for a variety of applications.

TLSR8258

Advanced SoC supporting multiple concurrent protocols. Supports all Bluetooth LE 5.1 features including AoA/AoD and Bluetooth LE Mesh. Offers high performance RF and low power consumption.

TLSR8253

Bluetooth LE chip supporting Bluetooth LE 5.1, including AoA/AoD, Bluetooth LE Mesh, and ADV extensions.

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