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    • Bluetooth® Mesh

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    Lose the bridge.

    Released in 2017, Bluetooth Mesh further expands the topology of Bluetooth LE to support many-to-many device networks and hence a wider coverage through multi-hop communication. As a market leader in mesh technology, Telink has been supplying proprietary and standard Bluetooth Mesh connectivity into the hands of some of the world's largest device-makers since as early as 2015.

    Telink Chips for Bluetooth® Mesh

    TLSR921x

    The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.

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    TLSR827x

    The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.

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    TLSR825x

    The TLSR825x series delivers an ultra-low power (ULP) concurrent multiprotocol IoT solution on the ISM 2.4GHz band. It has full protocol support for Bluetooth LE 5.0. It also supports Bluetooth Mesh, Zigbee, RF4CE, HomeKit, and 2.4GHz proprietary.

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    Telink Advantage

    Market Leader

    Telink was one of the first companies offering mesh technologies over Bluetooth LE in as early as 2015 – two years ahead of the Bluetooth standard.

    Flexibility

    Today Telink delivers both a proprietary mesh protocol over Bluetooth LE and the standard Bluetooth Mesh, offering customers the choice between customization and compatibility.

    Multi-protocol

    Telink’s multi-protocol SoCs support both Bluetooth Mesh and Zigbee on the same silicon along with choice of flexible switching schemes from one to the other.

    Applications for Bluetooth® Mesh

    Smart Home

    Smart devices that are easy to use and deliver seamless connectivity and convenience are in high demand. From smart lighting systems to smart locks and everything in between, Telink’s chips deliver the high performance, power efficiency, optimized BOM cost, and outof-the-box interoperability developers need to build the home of the future.

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    Health and Wellness

    Bluetooth LE has become the first choice for adding intelligence to healthcare devices and consumer goods. Smart healthcare devices and consumer goods use sensors to monitor health and usage data and transmit it to mobile devices for analysis, treatment,and improved user experience.

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