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The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.
The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.
Telink was one of the first companies offering mesh technologies over Bluetooth LE in as early as 2015 – two years ahead of the Bluetooth standard.
Today Telink delivers both a proprietary mesh protocol over Bluetooth LE and the standard Bluetooth Mesh, offering customers the choice between customization and compatibility.
Telink’s multi-protocol SoCs support both Bluetooth Mesh and Zigbee on the same silicon along with choice of flexible switching schemes from one to the other.