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The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.
Telink’s highlyintegrated cost-optimized SoCs reduce the number of external components developers must include, making disposable applications a reality.
Telink’s SoCs have passed comprehensive compatibility tests for most mainstream mobile phones on the market.
Telink’s products offer ultra- low power consumption for long device battery life.
The embedded power-efficient AI engine in Telink’s SoC enables more intelligent medical devices.
The ubiquitous presence, low power consumption and cost efficiency make Bluetooth LE the ideal technology when it comes to mobile phone connection. Telink supports the latest version of Bluetooth standards with its world-class SoCs and SDKs.
This M to M mesh topology based on Bluetooth LE enables applications that involve multiple inter -connected devices or sensor nodes.