Telink white logo with Telink word in small size

We noticed you are using Internet Explorer.

We recommend using one of the below listed browsers to enjoy the best experience of our website.

Click here to download:

Chrome

Firefox

Safari

Edge

This site uses cookies to ensure you get the best experience on our website.

Accept
Telink white logo with Telink word
Rotate your device top arrow

PLEASE ROTATE ME

Rotate your device bottom arrow
Preloader image
loading...
Telink white logo with Telink word in small size

    • Matter

    Scroll

    Matter is a unified IP-based royalty-free connectivity protocol built on proven technologies, including Thread, Bluetooth LE, and Wi-Fi, helping connect and build reliable, secure IoT ecosystems. Certified by Thread standard, Telink's TLSR9 series SoC can help customers quickly develop IoT smart devices that comply with both the Thread protocol and Matter standards.

    Telink Chips for Matter

    TLSR922X

    supports Bluetooth LE 5.3, Bluetooth Mesh, Zigbee Pro 2023, Thread, Matter, Apple HomeKit (Bluetooth LE & Thread) and 2.4GHz proprietary

    Learn More

    TLSR921x

    Supports Bluetooth LE 5.3, Bluetooth Mesh, Zigbee Pro 2023, Thread, Matter, Apple HomeKit (Bluetooth LE & Thread), Apple Find My network and 2.4GHz proprietary

    Learn More

    Telink Advantage

    Multi-connection

    Multi-protocol

    Telink’s multi-protocol SoC runs both Bluetooth LE and Thread, the two low-power connectivity options for Matter.

    Mature Solution

    Telink’s solution helps customer products obtain Matter certification and offers seamless compatibility with major smart home ecosystems.

    Complete Reference

    Telink provides a complete set of hardware and software reference to accelerate Matter development.

    Applications for Matter

    Smart Home

    Smart devices that are easy to use and deliver seamless connectivity and convenience are in high demand. From smart lighting systems to smart locks and everything in between, Telink’s chips deliver the high performance, power efficiency, optimized BOM cost, and outof-the-box interoperability developers need to build the home of the future.

    Learn More

    Contact Us

    Sales

    Support

    Or Call Your Sales Representative

    Investor Relations