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Thread
An emerging standard with a host of potential applications, Thread is progressively establishing itself as a viable protocol for a variety of IoT applications. Built on the power-efficient IEEE 802.15.4 MAC/PHY, Thread brings secure IP addressability and direct cloud access to mesh networks of up to thousands of devices.
TL322x Series
NEW
Telink TL322x series complies with mainstream wireless standards including BLE, Zigbee, RF4CE, Thread, Matter and 2.4GHz proprietary protocols. This single-chip multi-protocol solution enables cross-ecosystem connectivity with excellent performance for wireless IoT products.
The automotive-grade TL3225 SoC integrates CAN-FD/LIN, high-precision CS anti-relay positioning and ultra-low power consumption. AEC-Q100 certified, it accelerates development of secure automotive digital keys.
| Part Number | Type | Datasheet | Brochure | Protocol | MCU | SRAM | NVM | GPIO | Size（mm） | RoHS | Reliability | Composition | Errata | Purchase |
| TL3228AE11T80R | SoC |  |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 384KB | 2560KB | 64 | QFN80, 9x9 | |
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| TL3228AE10T80R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 256KB | 1536KB | 64 | QFN80, 9x9 | |
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| TL3228BE11T56R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 384KB | 2560KB | 40 | QFN56, 7x7 | |
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| TL3228BE10T56R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 256KB | 1536KB | 40 | QFN56, 7x7 | |
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| TL3228B0E10T56R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 256KB | 1024KB | 40 | QFN56, 7x7 | |
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| TL3228CE11T40R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 384KB | 2560KB | 22 | QFN40, 5x4 | |
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| TL3228C0E10T40R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 256KB | 1024KB | 22 | QFN40, 5x4 | |
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| TL3228CE09T40R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 384KB | 512KB | 22 | QFN40, 5x4 | |
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| TL3228WE09W59R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 384KB | 512KB | 33 | WLCSP59 3.28x2.65 | |
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| TL3225BG11T56R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 384KB | 2048KB | 42 | QFN56，7x7 | |
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| TL3225CG10T40R | SoC | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 256KB | 1024KB | 27 | QFN40，5x5 | |
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| TL3828AE10T80R | SoC | |
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- | Dual Core, RISC-V 32-bit | 256KB | 1536KB | 64 | QFN80, 9x9 | |
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| TL3828BE10T56R | SoC | |
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- | Dual Core, RISC-V 32-bit | 256KB | 1536KB | 40 | QFN56, 7x7 | |
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| ML3228A-GAIA-M3-PE11 | Module | |
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Bluetooth 6.1 | Dual Core, RISC-V 32-bit | 384KB | 2560KB | 64 | 18x35.3x2.6 |
Software
Hardware
Software
Telink provides a complete SDK to help you develop and build IoT smart devices, which covers your entire product life cycle, from development to OTA maintenance. The Telink SDK always includes the latest technology protocols and provides secure and stable connectivity, which, combined with Telink IoT Studio integrated development tools, can help quickly achieve mass production.
Hardware
Provide complete hardware guideline and reference design to build various device forms based on the Telink hardware development platform.
| Picture | Product Name | Description | User Manual | Design Guideline | Design File | Mouser | Digikey |
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TL322X EV-board | The TL322X EV-board is designed based on the TL322X chip and and is used to verify the TL3228X/3828X series chips and supports various functional tests. |
Download | Download | Download |  |
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TL3225B EV-Board | TL3225B EVB supports TL3225B/C chips and BLE 6.1 multi-protocol. It enables RF, CAN-FD/LIN and audio testing, with detailed hardware interface docs for easy development & debugging. |
Download | Download | Download | |
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AIOT-DK1 | AIOT-DK1 is a specialized development platform tailored for Telink modules, enabling flexible integration of Telink ML721X, ML321X and ML322X modules to streamline IoT product development. |
Download | |
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