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JBL Quantum 360P Gaming Headset Uses Telink SoCs for High-Quality, Low-Latency Audio

Telink Staff

November 27, 2023


JBL Quantum 360P gaming headset

Gamers expect top-of-the-line products to make their entertainment experience as immersive as possible. Thanks to Telink’s SoCs, the JBL Quantum 360P headset is one of them.

Major digital manufacturers around the world have always viewed the gaming industry as a highly competitive and desirable space to break into, and the complex requirements for device performance and unique needs in gaming scenarios often test technical capabilities.

At this year’s Consumer Electronics Show (CES), JBL launched several new gaming headsets as part of their Quantum series. One such new product is the JBL Quantum 360P, a wireless headset that supports dual-mode wireless connections.

Recently, 52Audio disassembled the JBL Quantum 360P wireless gaming headset and found that it uses the Telink Semiconductor TLSR9517C multi-protocol wireless SoC, which supports various wireless audio connection technologies and integrates 32 RISC-V MCU, 1MB Flash, stereo audio codec, AUX ADC, analog and digital microphone input, and other functional modules that enable 2.4G/Bluetooth® dual-mode connection. In addition, the USB wireless transceiver uses Telink’s TLSR9517B multi-protocol wireless SoC, which — when combined with the TLSR9517C chip inside the headset — helps the headset achieve ultra-low latency wireless transmission.

The headset supports two wireless connection methods: 2.4G and Bluetooth. The 2.4G mode is compatible with the new LC3 codec generation and can achieve 20ms ultra-low latency. 

The dual-mode connection allows Bluetooth to be used for answering phone calls when connected to the game console via the USB wireless transceiver.

JBL Quantum 360P headset motherboard

The headset has a 40mm driver unit, a 500mAh lithium battery, and a circuit protection board. The built-in motherboard is equipped with Telink’s TLSR9517C multi-protocol wireless SoC, a low-power linear charging chip, overvoltage, and overcurrent protection IC.

Close-up of Telink TLSR9517 semiconductor chip

The image above shows Telink’s TLSR9517C multi-protocol wireless SoC. This chip supports various connectivity technologies, including Bluetooth® 5.3, Basic Data Rate (BR), Enhanced Data Rate (EDR), LE Audio, and Telink’s proprietary low-latency protocol. As such, all the features required for high-quality wireless audio devices are conveniently integrated into a single SoC. 

In addition, the TLSR9517 series integrates 32-bit RISC-V MCU Flash, stereo audio codec, AUX ADC, analog and digital microphone input, PWM, and other peripheral modules. It achieves ultra-low power operation, making it suitable for various smart hearable and wearable devices that run on limited energy sources.

Datasheet for Telink TLSR9517 semiconductor chip

Detailed diagram of Telink Semiconductor’s TLSR9517 SoC.

52Audio further discovered that Telink’s multi-protocol wireless SoC solution is used by Soundcore VR P10 true wireless VR headset, Saramonic Blink500 ProX B2 wireless microphone, SmallRig Wave W1-C wireless lavalier microphone, Razer Wolverine V2 Pro wireless game controller, Xiaomi Walkie-Talkie 2S, and other mainstream products.

USB wireless transceiver

The USB wireless transceiver is equipped with Telink’s TLSR9517B wireless SoC, overvoltage and overcurrent protection IC, and a ceramic Bluetooth antenna for wireless transmission and reception.

Telink TLSR9517 chip inside USB transceiver

The image above shows Telink’s TLSR9517B wireless SoC inside the wireless transmitter, which — combined with the TLSR9517C chip inside the headset — brings ultra-low latency wireless audio transmission as low as 20ms to the headset.

Gaming-compatible features of Telink TLSR9517 SoC

52Audio Summary

In disassembling the JBL Quantum 360P wireless gaming headset, 52Audio found that it uses Telink Semiconductor’s TLSR9517C multi-protocol wireless SoC. The chip supports Bluetooth 5.3, Basic Data Rate (BR), Enhanced Data Rate (EDR), LE Audio, and Telink’s proprietary low-latency protocol. It also integrates 32-bit RISC-V MCU, 1MB Flash, stereo audio codec, AUX ADC, analog and digital microphone input, PWM, and other peripheral modules.

The USB wireless transceiver inside the headset uses Telink’s TLSR9517B wireless SoC in combination with Telink’s multi-protocol wireless SoC to achieve ultra-low latency of 20+ms and both Bluetooth and 2.4G connection modes. This combination creates high-quality wireless audio transmission that meets users’ needs for ultra-low latency in gaming scenarios.

Telink Semiconductor is a professional integrated circuit design company heavily involved in the research and development, design, and sales of wireless IoT system-level chips, with a focus on cutting-edge technology development and breakthroughs in this field. Through years of continuous R&D, Telink has become one of the largest companies in this global sector offering the widest product range.

Telink has successfully developed a series of wireless IoT system-level chips with independent intellectual property rights and world-class performance levels. The core parameters of its main products either meet or exceed the technical level of leading international enterprises and widely support various consumer and commercial IoT applications, including smart retail, consumer electronics, lighting, home, healthcare, warehousing logistics, audio entertainment, and more.

Note: This article was originally published on 52Audio.Visit Telink’s wiki to learn more about our development tools, or ask us a question through our Technical Forum or by contacting us directly today.

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