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March 30, 2022
Since launching over three decades ago, Bluetooth® is still booming. Here’s how Telink helped a customer redesign their products for best-in-class wireless data transfer.
When the first Bluetooth® wireless device launched in 1999, it drastically transformed the consumer experience. It offered newfound convenience thanks to spatial flexibility, customized control, and seamless device set-up.
Since then, wireless capabilities have remained in high demand. According to ABI Research, 35% of all IoT-connected devices rely on Bluetooth® technology. And 1.69 billion Bluetooth data transfer devices of all types will be shipped annually by 2025, highlighting the consumer appetite for IoT technology.
Recently Telink created a Bluetooth solution for a business that manufactures heat-pressing and cutting machines for at-home design creation. Our team brainstormed and developed a cost-effective way to bring wireless data transfer capabilities to their products. As a result, millions of units of the updated product have already shipped since early 2021.
Here’s how we built a robust wireless framework for this customer, using both versions of Bluetooth radios and our cutting-edge semiconductor chips and protocols.
Over the past year, Telink collaborated with a customer who needed to optimize the wireless potential of their heat-pressing and cutting machines used by buyers to craft homemade goods. The customer asked that Bluetooth LE connectivity be installed into their low-to-medium-tier machines, and that a Bluetooth Classic solution be nested into their higher-tiered machines.
The customer wanted their heat-pressing machines to be able to directly receive any made-to-order pattern from a PC, smartphone, or tablet. Additionally, the wireless hardware had to be compatible with the existing microcontroller module in both size and format, easily connect to the customer’s own application, and be OTA FW upgradeable. Because these machines operate on a relatively small quantity of data, Bluetooth LE was the ideal radio to use with the Data Length Extension (DLE) feature introduced in spec version 4.2.
On the other hand, the customer’s high-end cutting machines had to quickly transfer a larger pool of data that exceeded the maximum throughput of Bluetooth LE but could be accommodated by Bluetooth Classic. In addition, the Bluetooth Classic solution the customer opted for had to also support iAP2 protocol for compatibility with Apple devices, be compatible with the existing wireless IC module, and connect to the customer’s app with OTW FW upgradeability.
Project development commenced with one of Telink’s design partners. Throughout the duration of the creative process, Telink continually provided technical information and support that carried well into the production stage. Our focus was to craft a solution that would tick all of our customer’s boxes, so that their products would ultimately gain a competitive edge in their respective market.
Our team concluded that Telink’s mature TLSR827x SoC chip was a perfect match for the Bluetooth LE project as it supports spec version 4.2 with DLE and a flexible SDK to enable data transfer through proprietary profiles. This solution is specially tailored towards legacy wired devices and new products in need of support for wireless communication with mobile devices that involve smaller loads of data. Besides, it supports multi-master connectivity and can be implemented as either a USB dongle or PCB-soldered formatting.
Telink’s TLSR951x chip supports Bluetooth Dual-mode radio and was the best fit for the Bluetooth Classic project. Together with the SDK provided by Telink, this solution allowed for standard Serial Port Profile (SPP), and iAP2 protocol on Apple Devices to enable transferring hefty loads of data for both legacy and novel devices. Like the Bluetooth LE solution, this Bluetooth Classic solution supports multi-master connectivity and can either be soldered onto the main PCB or embedded in a USB dongle for increased adaptability. Moreover, with the support for both Bluetooth LE and Bluetooth Classic, TLSR951x is the ideal dual-mode wireless data transfer solution for customers who are seeking maximum technology flexibility and minimum supply chain overhead.
Within seven months, we were able to successfully generate product PO for the Bluetooth LE project — since early 2021, millions of units have shipped. As for the Bluetooth Classic project, production is soon to be underway, as the developmental stages necessitated more demanding brain power and creative input. Overall, the customer’s expectations were exceeded.
If your business could use a connectivity boost without all the tangled wires, Telink can help. Our range of SoC chips are best-in-class and affordable, so that your business can upgrade its operations without putting a dent in your wallet. No challenge is beyond our scope of expertise, so let us guide you towards a customized solution that addresses all of your functional needs.
For more information on how Telink can elevate your technological framework, please contact us or send emails directly to email@example.com.