JOIN US AT EMBEDDED WORLD NUREMBERG 2024!

We are pleased to invite you to join us at the Embedded World exhibition in Nuremberg, which will take place from April 9th to 11th, 2024.

The event is expected to attract tens of thousands of attendees from all over the world to witness the latest technology innovations.

As a participant in the exhibition, Telink Semiconductor will showcase our latest wireless connectivity technologies, chip products, and application samples. Our goal is to bring more innovation and excitement to Embedded World 2024.

To ensure that visitors will have a comprehensive understanding of cutting-edge lot technology, we have curated a series of application demonstrations. Some of the highlights include Matter over Thread Multi-fabric, Bluetooth Mesh 1.1 Key Features, Bluetooth LE Audio, High Accuracy Distance Measurement, Bluetooth PAWR & ESL, and Ultra-low-latency Wireless Gaming solutions. We are excited to connect with you on this dynamic platform and delve into the trends and potential applications of loT wireless technologies.