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Open Platform


An approachable smart home platform.

Telink is dedicated to providing a growing portfolio of open platform SDKs to connect to mainstream ecosystem platforms. Our SDKs are (or soon will be) connected to open platforms including Apple HomeKit, Open Thread, Alibaba, Mi, and Zephyr. This continues our legacy of providing customers with the most cutting-edge smart home solutions.

Benefits of Open Platform

Tier 1 Ecosystems

With millions of devices out in the wild and robust user buy-in, developers bringing emerging products to market have a leg up with tier 1 ecosystems.

Top-Notch Security

Tier 1 ecosystems take user privacy and security seriously, and developing on top of the most secure SoCs in the industry is a no-brainer.

Designed for Usability

Certified open platform SDKs deliver a user-friendly interface that puts the smart home directly into users’ hands.

Applications for Open Platform

With an already sizable share of consumer-facing applications, tier 1 ecosystems are poised to further expand their presence in the smart home.

Telink Chips for Open Platform


The TLSR825x series delivers an ultra-low power (ULP) concurrent multiprotocol IoT solution on the ISM 2.4GHz band. It has full protocol support for Bluetooth® LE 5.0. It also supports Bluetooth® Mesh, Zigbee, RF4CE, HomeKit, Thread, ANT, and 2.4GHz proprietary.


The TLSR827x series adds several key features on top of what the TLSR825x delivers. It has a flexible antenna element switch to fully support Bluetooth® LE 5.1, is RF inductor integrated (reducing BOM costs), and offers an audio enhancement and a WiFi PTA hardware interface.


The TLSR9 series is the latest addition to Telink’s family of high-performance, ultra-low power RF connectivity SoCs. The TLSR9 integrates a powerful 32-bit RISC-V MCU with a variety of outstanding core features and peripheral blocks to provide a foundation for advanced IoT devices.

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