Bringing together all your devices into a unified smart home.
Smart devices that are easy to use and deliver seamless connectivity and convenience are in high demand. From smart lighting systems to smart locks and everything in between, Telink’s chips deliver the high performance, power efficiency, optimized BOM cost, and outof-the-box interoperability developers need to build the home of the future.
Telink’s multiprotocol chips support major connectivity standards, reducing the risk involved in protocol selection for manufacturers and offering greater flexibility.
Compatibility
Telink’s SoCs have passed comprehensive compatibility tests for most mainstream mobile phones, and are built to operate seamlessly in today’s complex smart home ecosystems.
Performance & BOM Cost
Telink’s solutions deliver industry-leading connection stability, power consumption, and BOM savings for smart home devices.
Solutions for Smart Homes
Bluetooth® Mesh
Telink was one of the first companies to deliver solutions for Bluetooth LE Mesh, which is now the fastest-growing smart home/smart lighting standard and has been adopted in most Tier 1 ecosystems.
Zigbee
Integrate devices with Tier 1 customers’ platforms on Telink’s reliable, mature, and cost-efficient 802.15.4 SoCs and protocol stack.
Thread & Matter
Certified by Thread, Telink can help customers quickly develop IoT smart devices that comply with both the
Thread protocol and Matter standards.