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Telink Semiconductor (688591.SH) recently reached a significant milestone—the company's global chip shipments have surpassed two billion units. This achievement not only highlights Telink’s steady development and contributions in the field of low-power IoT chips but also motivates the company to continue innovating and advancing in IoT technology.

Telink’s CEO, Dr. Wenjun Sheng, stated: "Telink delivers a full range of wireless IoT system-on-chip (SoC) products, including multi-mode IoT chips, wireless audio chips, and proprietary protocol chips, all tailored to meet diverse IoT application needs. To enhance the market competitiveness of these products, Telink provides self-developed firmware protocol stacks and complete reference designs. This milestone is a testament to the quality and reliability of Telink products, which have been proven through market performance. It also highlights the stability and dependability of our supply chain system. Over the past few years, we have consistently maintained sufficient capacity to meet evolving market demands."

Looking back, Telink has never stopped in its path of technological innovation. In 2016, Telink pioneered the development of China's first multi-mode low-power IoT wireless connectivity SoC, the TLSR8269, which supports all major low-power IoT protocols on a single chip, including Bluetooth^® Low Energy, Bluetooth Mesh, ZigBee, Apple Homekit, and Thread. To date, the company has independently developed and owns numerous global intellectual property core patents, such as the “dual-mode RF transceiver architecture,” “dual-mode device and method for simultaneous communication,” “synchronization control method in wireless networks, wireless network, and smart home devices,” and “node and state update method in wireless networks.”

In 2018, Telink introduced the TLSR825x series, offering an excellent ultra-low-power, concurrent multi-protocol IoT solution that supports Bluetooth Low Energy, Bluetooth Mesh, Zigbee, RF4CE, and 2.4GHz proprietary protocols. Building on this, the subsequent TLSR827x series expanded capabilities with support for Apple Find My Network and introduced Bluetooth Low Energy Angle of Arrival (AoA) features. This series also brought significant enhancements, including reduced system power consumption, optimized overall bill of materials (BOM) costs, improved voice features, a more flexible and efficient on-chip power management system, and innovative designs such as a Wi-Fi coexistence hardware interface.

Telink continued to advance the industry by launching the TLSR9 series of low-power IoT chips, which utilize the RISC-V instruction set architecture. This series quickly gained traction in various IoT, consumer electronics, and wireless audio products, driving the adoption and popularization of RISC-V technology.

As a testament to its ongoing innovation, Telink has continued to release industry-leading products. The company's impressive accomplishments in IoT chip development not only demonstrate its strong technical expertise but also provide substantial momentum for the global IoT industry's growth. In addition to the widely recognized TLSR8 and TLSR9 series chips, Telink recently expanded its product lineup, offering a more diverse array of solutions tailored to meet the varied demands of IoT applications.

TLSR921x Series

The TLSR921x series features an advanced 32-bit RISC-V MCU  integrated with DSP and floating-point operation extension instructions. It became the first chip in China to be certified by Thread and the world’s first RISC-V instruction set architecture chip to receive PSA security certification.

TLSR951x Series

Telink officially entered the wireless audio field with the TLSR951x series. This series supports classic Bluetooth, Bluetooth Low Energy audio, and Telink's proprietary ultra-low latency wireless technology. Additionally, the chips integrate a powerful 32-bit RISC-V MCU and advanced audio codecs, earning praise from numerous audio device manufacturers.

TLSR922x Series

The TLSR922x series offers advanced on-chip security, making it ideal for IoT devices across consumer, commercial, and industrial applications. It simplifies smart home device configuration while ensuring reliability and security. The series also supports multiple ecosystem platforms and is compatible with the latest Matter Over Thread standard and the upcoming Bluetooth High Precision Location standard.

TLSR8208 Series

The TLSR8208 series supports Bluetooth Low Energy 5.3 and a 2.4GHz proprietary protocol. It provides standard peripheral interfaces and multiple packaging options, allowing for the development of basic IoT devices and wireless transmission modules with minimal external components.

TL721x (TLSR925x) Series

The TL721x series represents Telink's latest generation of high-performance, low-power, multi-protocol wireless IoT chips. It is designed to meet the requirements of future high-performance IoT terminals, focusing on low carbon, convergence, security, and intelligence. The TL721x is notable for being the first domestic wireless multi-protocol IoT chip to achieve an operating current at the milliamp level, marking a significant advancement in its category. Leveraging Telink’s extensive expertise in multi-protocol convergence technology, the TL721x supports both Bluetooth Low Energy and IEEE 802.15.4-based wireless communication on a single chip and is compatible with the latest upper-layer protocol standards. Additionally, it includes advanced security features to meet the demanding security requirements of global markets.

Telink’s chip products are used across various applications, including smart homes, remote controls, wireless audio, human-computer interaction devices, wearables, electronic shelf labels, location services, wireless gaming, medical health, and automotive electronics. The company has partnered with numerous prominent domestic and international brands and technology firms.

As IoT technology continues to advance and market demand grows, Telink remains confident in its future. With its deep technical expertise and industry experience, the company is dedicated to developing innovative products and solutions, aiming to deliver new advancements to the market and contribute significantly to the global IoT ecosystem.