Telink Semiconductor to sponsor Bluetooth Asia 2018 in Shenzhen and demonstrate various applications at the exhibition

Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for Bluetooth Low Energy and Bluetooth Mesh based on its devices at the Bluetooth Asia 2018 conference taking place in Shenzhen, China on 30-31 May 2018. At the…