Telink Semiconductor adds to its mesh networking offer with support for new Bluetooth SIG standard for many-to-many device communications

Shanghai, China, 1 August 2017 – Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, has announced the availability of an SDK (software development kit) which is fully compatible with the new Bluetooth SIG specification supporting mesh networking capability announced last month. This adds to its own…