Telink Semiconductor announces that it has been appointed a Bluetooth Special Interest Group (SIG) Board of Directors company

Low power wireless IoT silicon specialist Telink Semiconductor today announces that it has been appointed a Bluetooth Special Interest Group (SIG) Board of Directors company and now joins Apple, Bose, Ericsson AB, Intel, Microsoft, Motorola Mobility (Subsidiary of Lenovo), Nokia, and Toshiba on the Bluetooth SIG Board. In an official statement released, the SIG announced…

Telink Semiconductor to Exhibit at LIGHTFAIR® International 2019 in Philadelphia, Pennsylvania, May 21-23

SANTA CLARA, CALIFORNIA, MAY 6, 2019 — Telink Semiconductor is proud to announce that we will be exhibiting at LIGHTFAIR® International 2019 in Philadelphia, Pennsylvania, from Tuesday, May 21, through Thursday, May 23. This is a landmark year for LIGHTFAIR® International, which over the last three decades has become the world’s largest annual architectural and…

[Exhibition] 2018 Hangzhou • Yunqi Conference

2018 Hangzhou Yunqi Conference is launched in Yunqi Town on 19th September. Alibaba said that CEOs and CTOs from more than 60 countries will attend the conference and more than 120,000 visitors. As an important chip vendor of Alibaba Cloud IoT, Telink Semiconductor presents the latest solutions and applications at the conference (Booth No.: D3-104),…

[Exhibition] Bluetooth World 2018

18th – 19th September 2018, Silicon Valley, California, the Bluetooth World 2018 was held at the Santa Clara Convention Center. After two consecutive years of sponsorship and participation in Bluetooth Asia, this is the first time that Telink Semiconductor attend the Bluetooth World Conference. Telink Semiconductor participates actively in Bluetooth standard release, market education and…

Telink Semiconductor to sponsor Bluetooth Asia 2018 in Shenzhen and demonstrate various applications at the exhibition

Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for Bluetooth Low Energy and Bluetooth Mesh based on its devices at the Bluetooth Asia 2018 conference taking place in Shenzhen, China on 30-31 May 2018.At the conference,…

Telink Semiconductor to demonstrate smart lighting, smart home, retail and logistics applications at Bluetooth Asia 2017 in Shenzhen

Shanghai, China, 18 September 2017 – Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, will be demonstrating a number of applications for smart lighting, smart home, retail and logistics based on its devices at the Bluetooth Asia 2017conference taking place in Shenzhen, China on 26-27…

Telink Semiconductor adds to its mesh networking offer with support for new Bluetooth SIG standard for many-to-many device communications

Shanghai, China, 1 August 2017 – Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for internet of things (IoT) applications, has announced the availability of an SDK (software development kit) which is fully compatible with the new Bluetooth SIG specification supporting mesh networking capability announced last month. This adds to its own…

Telink Bluetooth Low Energy chip releases updated SDK for Apple HomeKit, providing single chip solution with built-in security key authentication for smart home devices

Shanghai, 20 March 2017 – Telink Semiconductor, developer of highly integrated low power radio-frequency and mixed signal system chips for Internet of Things (IoT) applications, has announced that it is releasing updated version of its Bluetooth LE SDK for Apple HomeKit. This means that any Apple HomeKit licensees can use Telink Semiconductor’s SDK  to develop products and…